• Physical Properties of Drawn Very Low Density Polyethylene Films
  • Kim BS, Lee JY
  • 연신 초저밀도 폴리에틸렌 필름의 물리적 특성
  • 김봉식, 이재연
Abstract
Very low density polyethylene (VLDPE) films were prepared by quenching the pressed melt in ice water. The films were drawn with universal testing machine under constant temperature at four different temperatures. 30. 60, 80, and 110℃. Thermal, mechanical properties, grossity, and gas permeability of the drawn VLDPE films as a function of draw ratio were investigated to examine their applicability to packaging. The films showed two melting peaks, i.e., low temperature endotherm (LTE) and high temperature endotherm (HTE). The melting temperatures were increased with the draw ratio and the drawing temperature. The mechanical properties of the VLDPE film drawn at 80℃ were superior to those drawn at 110℃. The grossity and gas permeability of the VLDPE film drawn at 110℃ were found to be best among the drawn films.

용융상에서 VLDPE 필름을 제조하고, 이 필름을 항온 cabinet이 부착된 만능시험기를 이용하여 연신하였다. 연신비와 온도에 따른 이들 필름의 열적, 기계적 특성, 광택도 및 가스투과율을 조사하였으며 포장재로서의 적용에 관해서 검토하였다. 이들 연신필름은 SCB의 조성비에 따라 두 개의 융점을 형성하였으며, 연신비와 연신온도에 따라 HTE와 LTE가 동시에 증가하는 특성을 나타내었다. 연신온도 110℃의 경우 연신비 8이상에서 LTE가 관찰되지 않았다. 한편 80℃에서 연신한 필름의 기계적 강도는 110℃에서 연신한 VLDPE 필름의 그것에 비하여 우수하였으나, 필름의 광택도와 기체 투과율은 측정온도 범위중 110℃에서 연신한 VLDPE 필름으로부터 우수한 결과를 얻었다.

Keywords: VLDPE film; thermal properties; mechanical properties; gas permeability

References
  • 1. Mimeault VJ, Plast. Eng., 41, 91 (1985)
  •  
  • 2. Ree M, Kyu T, Stein RS, J. Polym. Sci. B: Polym. Phys., 25, 105 (1987)
  •  
  • 3. Read BE, U.K. Nat. Phys. Lab. Div. Mater., 177, 7143 (1989)
  •  
  • 4. Sasaki I, Yamamoto N, Yanagase A, Kawachi Y, Ito KJapan Patent, 8985250 A2 (1989)
  •  
  • 5. Leder H, Oesterr. Kunstst. Z., 15, 36 (1984)
  •  
  • 6. Platzer N, Ind. Eng. Chem., 22, 158 (1983)
  •  
  • 7. Szekely G, Siklos P, Magy. Kem. Lapja, 38, 449 (1984)
  •  
  • 8. Cady LD, Plast. Eng., 43, 25 (1987)
  •  
  • 9. Bohm LL, Makromol. Chem., 182, 3291 (1981)
  •  
  • 10. Usami T, Gotoh Y, Macromolecules, 19, 1351 (1986)
  •  
  • 11. Wilfong DL, J. Polym. Sci. B: Polym. Phys., 28, 861 (1990)
  •  
  • 12. Shirayama K, Kita SI, Watabe H, Makromol. Chem., 151, 97 (1972)
  •  
  • 13. Nowlin TE, J. Polym. Sci. A: Polym. Chem., 26, 755 (1988)
  •  
  • 14. Constantin D, Hert M, Machon JP, Makromol. Chem., 179, 1581 (1978)
  •  
  • 15. Hsieh ET, Randall JC, Macromolecules, 15, 1402 (1982)
  •  
  • 16. Solti A, Hummel DO, Simak P, Makromol. Chem. Macromol. Symp., 5, 105 (1986)
  •  
  • 17. Bahl SK, Canterino PJ, Shaw RGGB 2152515 A1 (1985)
  •  
  • 18. Wild L, Ryle TR, Knobeloch DC, Polym. Prepr., 23, 133 (1982)
  •  
  • 19. Lee JY, Kim BS, Polym.(Korea), 18(5), 746 (1994)
  •  
  • 20. Burfield DR, Kashiwa N, Makromol. Chem., 186, 2657 (1985)
  •  
  • 21. Schoiterden P, Groeninckx G, Polymer, 28, 2099 (1987)
  •  
  • 22. French H, Jungnickel BJ, Plast. Rubber Comp. Proc. Appl., 16, 5 (1991)
  •  
  • 23. Springer H, Hengse A, Hohne J, Schich A, Hinrichsen G, Prog. Colloid Polym. Sci., 72, 101 (1986)
  •  
  • 24. Muller AJ, Balsamo V, Adv. Polym. Blends Alloys Technol., 5, 1 (1994)
  •  
  • 25. Mead WT, Desper CR, Porter RS, J. Polym. Sci. B: Polym. Phys., 17, 859 (1979)
  •  
  • 26. Young RJ, Lovell PAIntroduction to Polymers, 2nd ed., p. 265, Chapman & Hall, England (1991)
  •  
  • 27. Andrew EH, Martin GE, J. Mater. Sci., 9, 1507 (1974)
  •  
  • 28. Wunderlich BWMacromolecular Physics, vol. 3, p. 63, Academic Press, New York (1980)
  •  
  • 29. Bahl SK, Canterino PJ, Shaw RGGB 2152515 A1 (1985)
  •  
  • 30. Bahl SK, Canterino PJ, Shaw RGGB 2152516 A1 (1985)
  •  
  • 31. Hu S, Kyu T, Stein RS, J. Polym. Sci. B: Polym. Phys., 25, 71 (1987)
  •  
  • 32. tee JY, Kim BS, Polym.(Korea), 19(4), 478 (1995)
  •  
  • 33. Lee JY, Kim BS, Polym.(Korea), 20(4), 593 (1996)
  •  
  • 34. Comstock LR, Paint Technol., 44, 574 (1972)
  •  
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This Article

  • 1998; 22(3): 383-390

    Published online May 25, 1998