Article
  • Low Dielectric Constant and Low Dielectric Dissipation Polymer-ceramic Photo Solder Resist for High Frequency Applications

  • Hyun Jin Nam , Minkyung Shin*, Jae-Woong Jung, Young Bin Cho, Yunsik Park, Jong-In Ryu, and Se-Hoon Park†

  • ICT Device Packaging Research Center, Korea Electronics Technology Institute, Seongnam 13509, Korea
    *Electronic Convergence Materials and Devices Research Center, Korea Electronics Technology Institute, Seongnam 13509, Korea

  • 고주파수용 저유전 및 저손실의 폴리머-세라믹 타입 Photo Solder Resist

  • 남현진 · 신민경* · 정재웅 · 조영빈 · 박윤식 · 유종인 · 박세훈†

  • 한국전자기술연구원 ICT디바이스패키징연구센터, *한국전자기술연구원 융복합전자소재연구센터

  • Reproduction, stored in a retrieval system, or transmitted in any form of any part of this publication is permitted only by written permission from the Polymer Society of Korea.

References
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  • 5. Kim, D. K.; Park, S. D.; Yoo, M. J.; Sim, S. H.; Kyoung, J. B. Fabrication of Photosensitive Polymer Resistor Paste and Formation of Finely-Patterned Thick Film Resistors. J. Ind. Eng. Chem. 2009, 20, 622-627.
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  • 6. Kim, D. K.; Park, S. D.; Lee, K. B.; Kyoung, J. B. Thick Film Resistors with Low Tolerance Using Photosensitive Polymer Resistor Paste. Appl. Chem. Eng. 2010, 21, 411-416.
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  • 7. Mahan, K.; Kim, B.; Wu, B.; Han, B.; Kim, I.; Moon, H.; Hwang, Y. N. Modified Single Cantilever Adhesion Test for EMC/PSR Interface in Thin Semiconductor Packages. Microelectron. Reliab. 2016, 63, 134-141.
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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2023; 47(4): 535-539

    Published online Jul 25, 2023

  • 10.7317/pk.2023.47.4.535
  • Received on May 10, 2023
  • Revised on May 25, 2023
  • Accepted on May 26, 2023

Correspondence to

  • Se-Hoon Park

  • ICT Device Packaging Research Center, Korea Electronics Technology Institute, Seongnam 13509, Korea

  • E-mail: psh104@keti.re.kr